MSI offers a dual-chip design for the AMD X670.

Two chips still no active cooling

MSI tries to share as much information as possible on the AMD AM5 platform.

The company has already confirmed AMD EXPO . Technology For DDR5 overclocking profiles as well as post-install guide AMD Ryzen 7000 Engineering Preview CPU. AMD was clearly not happy that MSI was so clear with all this information, and in the end, Computex was just a demonstration rather than a full disclosure. Thus, some of this information has already been removed at AMD’s request.

But MSI clearly doesn’t bother with that. During the MSI Insider broadcast, the company showed off the AMD X670 chipset design without the heat exchangers. In fact, this is the first time we’ve seen the dual chipset design, which AMD has confirmed but not shown.

AMD X670 motherboard, Source: MSI

The AMD AM5 platform with LGA1718 socket will host CPUs up to 170W PPT (Socket Power). The first generation of AM5 CPUs will be based on Zen4 architecture with support for DDR5 memory and PCIe Gen5 hardware. The X670E and X670 chipsets, with their dual design, will provide up to 24 PCIe Gen5 slots for graphics and storage.

Although AMD has already confirmed, the new X670 chipset does not require active cooling. This will simply result in AMD 600 series motherboards, lower development cost, and possibly also lower power requirements.

AMD X670 Chipset Cooling, Source: MSI

The presentation of the Computex Ryzen 7000 and X670 is just a glimpse of what will be released this fall (officially). AMD has promised to provide more details this summer. B650 motherboards are expected to feature a single chipset design, which means smaller heatsinks.

source:

The following video has a timestamp